New product launch - T-P-Dual
EMI Thermal introduce a 'dual' product for thermal management applications. This new Void Filler is combined with a carrier and is ideal for where air gaps need to be removed but where electrical isolation is required. Despite being extremely soft and conformable with a low Shore 00 rating the presence of the electrically insulating carrier material ensures the material is easy to handle and apply.
Features include:
- Ultra-Soft with High Compressibility but easy to handle
- Thermal Void Filler with an Electrically Insulating Carrier
- Resistant to Cut-Through / Punctures
- 1.0 W/mK Thermal Conductivity
- Low Thermal Impedance
- Naturally Tacky
