T-P-DUAL Series Void Filler

T-P-DUAL Series Void Filler

Additional Images...

Picture of T-P-DUAL Series Void Filler

Void Filler / Gap with Electrically Insulating Carrier

A dual product for thermal management applications. This Void Filler is combined with a carrier and is ideal for where air gaps need to be removed but where electrical isolation is required. Despite being extremely soft and conformable with a low Shore 00 rating the presence of the electrically insulating carrier material ensures the material is easy to handle and apply.

Features and Benefits...

  • Ultra-Soft with High Compressibility
  • Thermal Void Filler with an Electrically Insulating Carrier
  • Resistant to Cut-Through / Punctures
  • 1.0 W/mK Thermal Conductivity
  • Low Thermal Impedance
  • Naturally Tacky

Applications...

  • Electronic Components: IC, CPU, MOS
  • LED, Motherboards, Power Supplies, Heat Sinks, LCD-TV, Notebook PC, PC
  • Telecom Devices, Wireless Hub, Automotive and Aerospace applications

Product Data...

Properties Test Method Unit T-P-Dual Series
Material - - Ceramic filled silicon elastomer
Colour Visual - White + Pink
Thickness (±10%) Increments of 0.25mm/0.01inch - - 0.50 - 5.00
0.02 - 0.20
Thermal Conductivity ASTM-D5470 W/mK 1.0
Hardness (±10) ASTM-D2240 Shore 00 00 20
Flammability Rating UL94 - V0
Breakdown Voltage (1.0mm) ASTM-D149 kV ≥10
Specific Gravity - g/cm3 2.3
Working Temperature - ˚C -40 to 200
Volume Resistance ASTM-D257 Ohm-cm 1012
Thermal Impedance (4mm/Shore 00 20)
Deflection Rate (%) Thermal Impedance (°C-in2/W)
10 4.71
20 4.28
30 3.85

Notes:

  1. Customised shapes are available
  2. The above performance data is tested in an environment of 70% humidity, temperature 25℃.
  3. This data is intended for reference purposes only. It is recommended that the material is tested to fully evaluate its performance ensuring it is fit for purpose.