Thermal Void Filler T-P-2 Series

Thermal Void Filler T-P-2 Series

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Void Filler / Gap Filler 1.0 W/mK

Air is a poor thermal conductor and for efficient thermal management, air gaps should be removed with a Void Filler, a Thermal Interface Material. The gaps that need to be addressed are between the heat-generating components and the heat sink or thermal conductive product case.

Features and Benefits...

  • Soft with High Conformability
  • 1.0 W/mK Thermal Conductivity
  • Low Thermal Impedance
  • Naturally Tacky

Applications...

  • Electronic Components: IC, CPU, MOS
  • LED, Motherboards, Power Supplies, Heat Sinks, LCD-TV, Notebook PC, PC
  • Telecom Devices, Wireless Hub, Automotive and Aerospace applications
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Product Data...

Properties Test Method Unit T-P-2 Series
Material - - Ceramic filled silicon elastomer
Colour Visual - Light Grey
Thickness (±10%)
Increments of 0.25mm/0.01inch		 - - 0.50 - 5.00
0.02 - 0.20
Thermal Conductivity ASTM-D5470 W/mK 1.0
Hardness (±10%) ASTM-D2240 Shore 00 45 (≥1.00mm)
65 (<1.00mm)
Flammability Rating UL94 - V0
Breakdown Voltage (1.0mm) ASTM-D149 kV ≥7.5
Specific Gravity   g/cm3 2.3
Working Temperature   °C -40 to 200
Volume Resistance ASTM-D257 Ohm-cm 1012
Tensile Strength ASTM-D412-1998A Mpa 0.45
Thermal Impedance (2.10mm/Shore 00 70)
Deflection Rate (%) Thermal Impedance (°C-in2/W)
10 2.34
20 1.74
30 1.13

Notes:

  1. Customised shapes are available
  2. The above performance data is tested in an environment of 70% humidity, temperature 25°C.
  3. This data is intended for reference purposes only. It is recommended that the material is tested to fully evaluate its performance ensuring it is fit for purpose.

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