Thermal Void Filler Two Part Liquid

Thermal Void Filler Two Part Liquid

LVF-10

Product Description...

A two-part silicone-based liquid Thermal Interface Material with heat-conducting filler and binding materials. When the compound is mixed and cured it acts as a thermally conductive void filling material.

Features and Benefits...

  • Good Thermal Conductivity
  • Excellent Dielectric Performance
  • Long Life Span
  • Weather Resistance
  • Low Mechanical Stress
  • Vibration and Shock Absorbance Properties

Applications...

Electronic shielding of wiring & high-end electronic products like:

  • Electronic assemblies, thermistors, temperature sensors, power modules.
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Product Data...

Properties Unit LVF-10 Test method
Colour - Part A: White
Part B: Grey		 Visual
Thermal Conductivity (±10%) W/mK 1.0 ASTM D5470
Viscosity (Mixed) Pa 20-50 ASTM D2196
Breakdown Voltage (1mm) KV ≥5 ASTM D149
Specific Gravity g/cm3 1.88 ASTM 5740
Working Temperature ◦C -40 to 180 EM344
Volume Resistance Ohm-cm ≥1012 ASTM D257
Flammability Rating - V0 UL 94
Hardness (±5)
Hardness, Thirty second delay (±5)		 Shore 00
Shore 00		 50
25		 ASTM D412
ASTM D412
Surface Drying Time (25◦C) min 20-30 -
Curing Time (25◦C)
Curing Time (60◦C)
Curing Time (100◦C)		 min
min
min		 ≥50
10-15
5-10		 -
-
-

Notes:

  1. Custom dispensers and containers to suit volume requirements
  2. Mix ratio by Weight or Volume 1:1
  3. The above performance data is tested in an environment of 70% humidity, temperature 25℃.
  4. This data is intended for reference purposes only. It is recommended that the material is tested to fully evaluate its performance ensuring it is fit for purpose.

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