Thermal Interface Materials (TIM)
Modern electronic designs invariably result in components being worked harder, running at higher power which inevitably means operating temperatures are increasing. Failure to carefully consider thermal management can quickly lead to overheating of components, poor performance, damage or even failure.
An essential part of managing thermal issues is to ensure there are no voids or gaps filled with air between the heat-generating components and the thermal device such as a heatsink. If air remains between the mating surfaces the ability to transfer heat away from the components will be greatly compromised.
To fill those air gaps EMI Thermal offer a dynamic range of Thermal Interface Materials that includes Natural Graphite, Void / Gap Fillers, Electrically Isolating TIM, Thermal Phase Change materials.
Most products are available in a choice of thicknesses, with or without a self-adhesive backing. In addition to our standard sheet sizes, we can also supply larger sheets, rolls, or custom-manufactured parts and gaskets to meet your specific requirements.













