T-P-3 Series

T-P-3 Series

Additional Images...

Picture of T-P-3 Series
Image of T-P-3 Series

Void Filler / Gap Filler 1.5 W/mK

Void or Gap Fillers are essential for filling air gaps between heat generating components and heatsinks or thermally conductive product cases.

Features and Benefits...

  • Ultra-Soft with High Compressibility
  • 1.0 W/mK Thermal Conductivity
  • Low Thermal Impedance
  • Naturally Tacky

Applications...

  • Electronic Components: IC, CPU, MOS
  • LED, Motherboards, Power Supplies, Heat Sinks, LCD-TV, Notebook PC, PC
  • Telecom Devices, Wireless Hub, Automotive and Aerospace applications

Product Data...

PropertiesTest MethodUnitT-P-3 Series
Material - - Ceramic Filled Silicon Elastomer
Colour Visual - Black
Thickness (±10%)
Increments of 0.25mm/0.01inch
- - 0.5 - 5.00
0.02 - 0.20
Thermal Conductivity ASTM-D5470 W/mK 1.5
Hardness (±10%) ASTM-D2240 Shore 00 45 (≥1.00mm)
65 (<1.00mm)
Flammability Rating UL94 - V0
Breakdown Voltage (1.0mm) ASTM-D149 kV ≥7.5
Specific Gravity   g/cm3 2.7
Working Temperature   °C -40 to 200
Volume Resistance ASTM-D257 Ohm-cm 1012
Tensile Strength ASTM-D412-1998A Mpa 0.41
Thermal Impedance (1.55mm/Shore 00 60)
Pressure (psi)Thickness (mm)Compression Ration (%)Thermal Impedance (°C-in2/W)
10 1.52 1.5 2.03
20 1.4 9.9 1.88
30 1.3 16 1.75
40 1.23 20.8 1.66
50 1.16 24.9 1.58
60 1.11 28.5 1.52

Notes:

  1. Customised shapes are available
  2. The above performance data is tested in an environment of 70% humidity, temperature 25°C.
  3. This data is intended for reference purposes only. It is recommended that the material is tested to fully evaluate its performance ensuring it is fit for purpose.
  4. These are standard material specifications. Other Hardness values are available upon request.