T-P-9 Series Void Filler

T-P-9 Series Void Filler

Additional Images...

Picture of T-P-9 Series Void Filler
Image of T-P-9 Series Void Filler

Void Filler / Gap Filler 5.0 W/mK

A Void Filler with our highest thermal conductivity of 5.0 W/mK to protect components by filling air gaps and offer the most efficient transfer of heat to a heatsink.

Features and Benefits...

  • Soft with High Conformability
  • 5.0 W/mK Thermal Conductivity
  • Low Thermal Impedance
  • UL94 V0 Recognised
  • Naturally Tacky

Applications...

  • Electronic Components: IC, CPU, MOS, LED, M/B, P/S, Heat Sinks, LCD-TV’s, Notebook PC, PC, Telecommunication Devices
  • Wireless Hubs, DDR Modules, DVD Applications, Hand-set Applications etc.

Product Data...

Properties Test Method Unit T-P-9 Series
Material - - Ceramic filled silicon elastomer
Colour Visual - Copper
Thickness (±10%)
Increments of 0.25mm/0.01inch
- - 0.50 - 5.00
0.02 - 0.20
Thermal Conductivity ASTM-D5470 W/mK 5.0
Hardness (±10) ASTM-D2240 Shore 00 65 (≥1.0mm)
80 (<1.0mm)
Flammability Rating UL94 - V0
Breakdown Voltage (1.0mm) ASTM-D149 kV ≥7.5
Specific Gravity - g/cm3 3.11
Working Temperature - ˚C -40 to 200
Volume Resistance ASTM-D257 Ohm-cm 1012
Tensile Strength ASTM-D412-1998A MPa 0.15
Thermal Impedance (1.2mm/Shore 00 60)
Deflection Rate (%) Thermal Impedance (°C-in2/W)
10 0.46
20 0.41
30 0.36

Notes:

  1. Customised shapes are available
  2. The above performance data is tested in an environment of 70% humidity, temperature 25℃.
  3. This data is intended for reference purposes only. It is recommended that the material is tested to fully evaluate its performance ensuring it is fit for purpose.